Features: Al2O3-based bonding, potting and encapsulating delicate electronic assembles, sensors, instruments and general purpose high temp. Applications.
Typical Cure Schedule: 23 °C / 4 - 8 hours or 80 °C / 5 minutes
Operating Temperature: 1090 °C
Consistency: powder/binder
Features: ZrO2-based, NASA approval, for non-absorbent surfaces. Fast setting adhesive used for sealing and assembling parts, encapsulate heating elements, or as electrically resistant coatings.